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个人信息Personal Information
副教授
博士生导师
硕士生导师
性别：男
毕业院校：日本东北大学
学位：博士
所在单位：材料科学与工程学院
电子邮箱：w-dong@dlut.edu.cn
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- [1]黄自德, 许富民, 郭素墨, 董伟.2219铝合金再结晶行为研究[J],热加工工艺,2019,47(24):211-214
- [2]董伟, 李文畅, 许富民, 韩阳, 张伟.单分散铁基Fe60Ni7.5Mo7.5P10C10B5金属玻璃球形粒子的制备及评价[J],材料工程,2018,46(10):30-36
- [3]Hu, Ying-yan, Yue, Wen, Li, Jian-qiang, Dong, Wei, Can, Ma, Bing-qian, Liu, Chao, Han, Jian-jun.Preparation and characterization of monosized Cu-Sn spherical alloy particles by pulsated orifi...[J],JOURNAL OF MATERIALS RESEARCH,2018,33(18):2835-2843
- [4]Zhong, Y., Zhao, N., Dong, W., Wang, Y. P., Ma, H. T., N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..In situ study on the effect of Cu5Zn8 intermetallic layer on the Cu-Ni cross interaction in Cu/...[J],MATERIALS CHEMISTRY AND PHYSICS,2018,216:130-135
- [5]董伟, 李文畅, 康世薇, 许富民, 韩阳, 白兆丰.脉冲微孔喷射法单分散球形微粒子的制备及其应用[J],材料工程,2018,46(2):142-151
- [6]Zhong, Yi, Zhao, Ning, Dong, Wei, Wang, Yunpeng, Ma, Haitao.Growth mechanism of Cu3Sn grains in the (111)Cu/Sn/Cu micro interconnects[A],2018,1748-1750
- [7]Zhong, Y., Zhao, N., Liu, C. Y., Dong, W., Qiao, Y. Y., Wang, Y. P., Ma, H. T., N, Dong, W (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Continuous epitaxial growth of extremely strong Cu6Sn5 textures at liquid-Sn/(111)Cu interface ...[J],APPLIED PHYSICS LETTERS,2017,111(22)
- [8]Zhong, Yi, Zhao, Ning, Dong, Wei, Ma, Haitao, Huang, Mingliang, Yin, Luqiao, Wong, Chingping, N, Ma, HT (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Coupling effect of thermomigration and cross-interaction on evolution of intermetallic compound...[J],JOURNAL OF MATERIALS RESEARCH,2017,32(16):3128-3136
- [9]Zhao, N., Zhong, Y., Dong, W., Huang, M. L., Ma, H. T., Wong, C. P., N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China., Wong, CP (reprint author), Georgia Inst Technol, Atlanta, GA 30332 USA..Formation of highly preferred orientation of beta-Sn grains in solidified Cu/SnAgCu/Cu micro in...[J],APPLIED PHYSICS LETTERS,2017,110(9)
- [10]Zhong, Y., Zhao, N., Ma, H. T., Dong, W., Huang, M. L., N, Dong, W (reprint author), Dalian Univ Technol, Elect Packaging Mat Lab, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..Retardation of thermomigration-induced Cu substrate consumption in Pb-free solder joints by Zn ...[J],JOURNAL OF ALLOYS AND COMPOUNDS,2017,695:1436-1443
- [11]Zhong, Y., Zhao, N., Ma, H. T., Dong, W., Huang, M. L., Wong, C. P..Low temperature Ni/Sn/Ni transient liquid phase bonding for high temperature packaging applicat...[A],2017,0:411-416
- [12]Zhong, Yi, Zhao, Ning, Dong, Wei, Ma, Haitao, Wang, Yunpeng, Wong, Ching-Ping.Formation of preferred orientation of Cu6Sn5 grains in Cu/Sn/Cu interconnects by soldering unde...[A],2017,1438-1441
- [13]赵宁, 黄明亮, 马海涛, 董伟.Formation of highly preferred orientation of β-Sn grains in solidified Cu/SnAgCu/Cu micro interc...[J],Applied Physics Letters,2017,110(9):93504-
- [14]Zhao, N., Zhong, Y., Huang, M. L., Ma, H. T., Dong, W., N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Elect Packaging Mat Lab, Dalian 116024, Peoples R China..Dissolution and precipitation kinetics of Cu6Sn5 intermetallics in Cu/Sn/Cu micro interconnects...[J],INTERMETALLICS,2016,79:28-34
- [15]董伟, 魏宇婷, 康世薇, 盖如坤, 许富民, 鲁栋, Dong, Wei(w-dong@dlut.edu.cn).基于脉冲微孔喷射的液滴沉积成型[J],材料工程,2016,44(10):1-7
- [16]Zhao, N., Dong, W., Ma, H. T., Wang, Y. P., Zhong, Y., Huang, M. L., N (reprint author), Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..In situ study on interfacial reactions of Cu/Sn-9Zn/Cu solder joints under temperature gradient[J],JOURNAL OF ALLOYS AND COMPOUNDS,2016,682:1-6
- [17]Zhao, Ning, Zhong, Yi, Huang, Mingliang, Ma, Haitao, Dong, Wei.Synchrotron radiation in situ study on the solidification of Cu/Sn-58Bi/Cu solder joint under t...[A],2016,264-267
- [18]董伟, 康世薇, 魏宇婷, 许富民, 李鹏廷.脉冲微孔喷射技术及其在增材制造方面的应用[J],航空制造技术,2016,12:16-22
- [19]Zhong, Yi, Huang, Mingliang, Ma, Haitao, Dong, Wei, Wang, Yunpeng, Zhao, Ning, N (reprint author), Dalian Univ Technol, Elect Packaging Mat Lab, Sch Mat Sci & Engn, Dalian 116024, Peoples R China..In situ study on Cu-Ni cross-interaction in Cu/Sn/Ni solder joints under temperature gradient[J],JOURNAL OF MATERIALS RESEARCH,2016,31(5):609-617
- [20]Zhong, Yi, Huang, Mingliang, Deng, Jianfeng, Ma, Haitao, Dong, Wei, Zhao, Ning.STUDY ON PRECIPITATION AND DISSOLUTION OF INTERFACIAL CU6SN5 DURING THERMOMIGRATION[A],2016